期刊
ADVANCED MATERIALS
卷 17, 期 21, 页码 2567-+出版社
WILEY-V C H VERLAG GMBH
DOI: 10.1002/adma.200500777
关键词
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Photoembossing is a solvent-free photolithographic technique for the production of polymeric relief microstructures (see Figure). A combinatorial methodology to explore the influence of different parameters (e.g., processing temperature, binder content, photoinitiator content) on the resultant relief structure is presented using an acrylate-based model system. Results are discussed in the framework of a diffusion-polymerization model..
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