期刊
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
卷 12, 期 1-2, 页码 110-115出版社
SPRINGER HEIDELBERG
DOI: 10.1007/s00542-005-0012-z
关键词
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The hot embossing process is a flexible molding technique to produce delicate microstructures with high aspect ratios on thin layers. Large-scale hot embossing is one effective way to meet future requirements and produce high-quality microstructures at low costs. For this, however, principal changes of the molding process and molding tool design will be required. In the present paper, constructive solutions for large-scale hot embossing shall be described. Based on a simulation of the hot embossing process, solutions shall be presented that are aimed at reducing shrinkage of the molded parts and demolding forces and, hence, at avoiding damages of microstructures during demolding.
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