Nanoimprint pattern transfer quality from specular x-ray reflectivity

Specular x-ray reflectivity is used for high precision measurements of the pattern height, residual layer thickness, and the line-to-space ratio for parallel line and space patterns fabricated with nanoimprint lithography. The line-to-space ratio is profiled vertically to reveal relative linewidth variations as a function of the feature height. These relative linewidth variations are quantified through an external measure of the average pitch to fully define the line shape profile or cross section. An excellent fidelity of the nanoimprint pattern transfer process is quantified by comparing the line shape profiles of the mold to the imprinted pattern. (c) 2005 American Institute of Physics.