Some textural, sensory and nutritional properties of expanded snack food wafers made from corn, lentil and other ingredients

Crisp expanded wafers were produced from extruded pellets containing specialty starches and flours derived from peas, lentils, corn and blends of lentils and corn. The density, hardness and consumer acceptability of the wafers varied with the different ingredients. The most acceptable products were produced from corn, lentils and blends of these two ingredients. The weight, density, stiffness and hardness of the wafers increased with the proportion of lentil flour used to make them. Sensory analysis suggested that consumer acceptability was optimal for blends containing between 40 and 80% of lentil flour. Stiffness and fracture force measured by texture profile analysis were correlated with the sensory attributes of hardness and toughness. The glycemic potential measured by in vitro digestion of the wafers was lower for the 100% lentil wafers compared with the 100% corn wafers because of the amount of starch in the grain. For combinations of corn and lentils, the carbohydrate digestion rate, and hence the glycemic potential, was lower than for either 100% corn or 100% lentil wafers. Blending of selected cereal flour ingredients should be a useful method for reducing the glycemic impact of cooked starchy snacks.