期刊
SCRIPTA MATERIALIA
卷 54, 期 6, 页码 983-986出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2005.11.037
关键词
twin boundaries; copper; electron backscatter diffraction (EBSD); equal channel angular extrusion (ECAE) Thin films
Annealing twin boundaries are important in the evolution of grain boundary engineered materials. The development of annealing twins in face-centered cubic metals is a function of stacking fault energy and a number of other factors. It is observed that annealing heavily deformed copper under shear stress tends to promote the formation of twin boundaries. (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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