This paper presents the use of a novel fabrication technique to produce three-dimensional (3D) nanostructures. The process is based on conventional microfabrication techniques to create a planar pattern in an InGaAs/GaAs bilayer that self-assembles into 3D structures during a wet etch release. The nanostructures are proposed to function as nanosprings for electromechanical sensors. Nanomanipulation inside a scanning electron microscope (SEM) was conducted to probe the structures for mechanical characterization. The results were validated by simulation.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据