4.3 Article

Thermal conductivity of AlN and SiC thin films

期刊

INTERNATIONAL JOURNAL OF THERMOPHYSICS
卷 27, 期 3, 页码 896-905

出版社

SPRINGER/PLENUM PUBLISHERS
DOI: 10.1007/s10765-006-0062-1

关键词

3 omega method; aluminum nitride; silicon carbide; thermal conductivity; thickness; thin film

向作者/读者索取更多资源

The thermal conductivity of AlN and SiC thin films sputtered on silicon substrates is measured employing the 3 omega method. The thickness of the AlN sample is varied in the range from 200 to 2000 nm to analyze the size effect. The SiC thin films are prepared at two different temperatures, 20 and 500 degrees C, and the effect of deposition temperature on thermal conductivity is examined. The results reveal that the thermal conductivity of the thin films is significantly smaller than that of the same material in bulk form. The thermal conductivity of the AlN thin film is strongly dependent on the film thickness. For the case of SiC thin films, however, increased deposition temperature results in negligible change in the thermal conductivity as the temperature is below the critical temperature for crystallization. To explain the thermal conduction in the thin films, the thermal conductivity and microstructure are compared using x-ray diffraction patterns.

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.3
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据