期刊
SCRIPTA MATERIALIA
卷 54, 期 9, 页码 1661-1665出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.scriptamat.2006.01.006
关键词
phase transformations; intermetallic compounds; lead-free solder
The interfacial morphologies for the Sn-3Ag-0.5Cu/Ni-P joint were investigated using a field emission electron probe microanalyzer (FE-EPMA). As the Ni-Sn-P formed, several layers of P-rich layers including Ni3P, Ni12P5, and Ni2P were observed. The relationship between Ni-Sn-P formation and the evolution of P-rich layers was quantitatively analysed by FE-EPMA and by using the phase diagram of binary Ni-P. It was also proposed that once the Ni2P phase was formed, Sri atoms diffused from the solder matrix into Ni2P. As a result, the original Ni2P transformed to Ni2SnP due to the in-diffusion of Sri. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据