期刊
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
卷 29, 期 2, 页码 341-349出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TCAPT.2006.875898
关键词
alloys; electric contacts; microelectromechanical systems (MEMS); microswitch
This paper is the first to report on a new analytic model for predicting microcontact resistance and the design, fabrication, and testing of microelectromechanical systems (MEMS) metal contact switches with sputtered bimetallic (i.e., gold (Au)-on-Au-platinum (Pt), (Au-on-Au-(6.3at%)Pt)); binary alloy (i.e., Au-palladium (Pd), (Au-(3.7at%)Pd)), and ternary alloy (i.e., Au-Pt-copper (Cu), (Au-(5.0at%)Pt-(0.5at%)Cu)) electric contacts. The microswitches with bimetallic and binary alloy contacts resulted in contact resistance values between 1-2 Omega. Preliminary reliability testing indicates a 3 x increase in switching lifetime when compared to microswitches with sputtered An electric contacts. The ternary alloy exhibited approximately a 6 x increase in switch lifetime with contact resistance values ranging from approximately 0.2-1.8 Omega.
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