As integrated circuits have shrunk, conventional electron microscopies have proven inadequate for imaging complicated interconnect structures due to the overlap of features in projection. These techniques produce transmission functions with a nonmonotonic dependence of intensity on thickness for common microelectronic materials, making them unsuitable for tomography. We report the use of an incoherent bright field imaging technique in a scanning transmission electron microscope optimized for the three-dimensional reconstruction of thick copper microelectronic structures. Predictable behavior of the signal in samples up to similar to 1 mu m thick allows us to reconstruct and quantify the shape and volume of stress voids within Ta-lined interconnects.
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