Atomic layer deposition (ALD) Al2O3 is a high-quality gate dielectric on III-V compound semiconductor with low defect density, low gate leakage, and high thermal stability. The high-quality of Al2O3/InGaAs interface surviving from high temperature annealing is verified by excellent capacitance-voltage (CV) curves showing sharp transition from depletion to accumulation with zero hysteresis, 1% frequency dispersion per decade at accumulation capacitance, and strong inversion at split CV measurement. An enhancement-mode n-channel InGaAs metal-oxide-semiconductor field-effect-transistor is also demonstrated by forming true inversion channel at Al2O3/InGaAs interface.
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