Advanced high-κ dielectric stacks with polySi and metal gates:: Recent progress and current challenges

The paper reviews our recent progress and current challenges in implementing advanced gate stacks composed of high-kappa dielectric materials and metal gates in mainstream Si CMOS technology. In particular, we address stacks of doped polySi gate electrodes on ultrathin layers of high-kappa dielectrics, dual-workfunction metal-gate technology, and fully silicided gates. Materials and device characterization, processing, and integration issues are discussed.