期刊
THIN SOLID FILMS
卷 510, 期 1-2, 页码 62-67出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.tsf.2005.12.155
关键词
copper; resistivity; conductivity; surface conductivity; grain boundary; electron scattering; scanning electron microscopy; sputtering
Materials with nanometric dimensions exhibit higher electrical resistivity due to additional scattering centers for the conduction electrons, mainly from surfaces and grain boundaries. In this study we focus on the effect of grain boundaries by modeling the expected resistivity due to the observed log-normal distribution of boundaries, unlike the widely used model of Mayadas and Shatzkes that assumes a Gaussian distribution. The results of the model are then experimentally explored by correlating the resistivity of thin copper films with their grain size distribution. Applying a newly suggested analysis method solves the ambiguity in distinction between surface scattering and grain boundaries scattering. It is found that for the explored layers the increase in resistivity is dominated by the effect of grain boundaries. (c) 2005 Elsevier B.V. All rights reserved.
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