Three-dimensional nanosprings for electromechanical sensors

This paper presents the use of a novel fabrication technique to produce three-dimensional (3D) nanostructures with nanoscale features that can be used for electromechanical sensors. The process uses conventional microfabrication techniques to create a planar pattern in a SiGe/Si bilayer that then self-assembles into 3D structures during a wet etch release. An additional metal layer can be integrated for higher conductivity. Results from the fabrication of the structures are demonstrated. Nanomanipulation inside a scanning electron microscope (SEM) was conducted to probe the structures for mechanical and electrical characterization. The experimental characterization results were validated by finite element simulation. (c) 2005 Elsevier B.V. All rights reserved.