SU-8 nanocomposite photoresist with low stress properties for microfabrication applications

A new nanocomposite photoresist based on SU-8 epoxy resin has been developed. It consists in a homogeneous dispersion of nanosilica particles in the negative tone photosensitive SU-8. The nanocomposite photoresist is more sensitive than the SU-8 photoresist and the photopatterned composite structures show low stress and less cracks than pure SU-8 structures. No significant resolution difference has been observed for both materials. (c) 2006 Elsevier B.V. All rights reserved.