期刊
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS
卷 45, 期 10B, 页码 8228-8234出版社
JAPAN SOC APPLIED PHYSICS
DOI: 10.1143/JJAP.45.8228
关键词
microplasma; atmospheric pressure; wire spraying; CVD; microdeposition; plasma jet; metal oxide; reactive evaporation; tungsten oxide; patterning
We developed a safe technique without using a toxic gas source to deposit tungsten oxide on a localized specific area using an atmospheric pressure microplasma jet. In this technique, a consumable tungsten wire, inserted into a quartz nozzle for microplasma generation, was etched with an O-2/Ar microplasma, and the resultant tungsten oxide was deposited on the substrate placed downstream. The process mechanism was determined by the detailed observation of the deposit and consumed wire surface after processing, and optical emission spectroscopy. This technique is expected to be utilized for the localized deposition of a variety of metal oxides by varying the kind of consumable metal wire.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据