期刊
APPLIED THERMAL ENGINEERING
卷 26, 期 17-18, 页码 2457-2463出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.applthermaleng.2006.02.036
关键词
nanofluids; microchannel; heat sink; thermal resistance; nanoparticles
In this paper, the cooling performance of a microchannel heat sink with nanoparticle-fluid suspensions (nanofluids) is numerically investigated. By using a theoretical model of thermal conductivity of nanofluids that accounts for the fundamental role of Brownian motion, we investigate the temperature contours and thermal resistance of a microchannel heat sink with nanofluids such as 6 nut copper-in-water and 2 nm diamond-in-water. The results show that the cooling performance of a microchannel heat sink with water-based nanofluids containing diamond (1 vol.%, 2 nm) at the fixed pumping power of 2.25 W is enhanced by about 10% compared with that of a microchannel heat sink with water. Nanofluids reduce both the thermal resistance and the temperature difference between the heated microchannel wall and the coolant. Finally, the potential of deploying a combined microchannel heat sink with nanofluids as the next generation cooling devices for removing ultra-high heat flux is shown. (c) 2006 Published by Elsevier Ltd.
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