期刊
JOURNAL OF MATERIALS RESEARCH
卷 21, 期 12, 页码 2971-2974出版社
CAMBRIDGE UNIV PRESS
DOI: 10.1557/JMR.2006.0368
关键词
-
Tin whisker growth has been observed since the 1950s and has become of more interest in the past 15 to 20 years due to the desire to use lead-free solders, pure tin being, a good lead-free candidate. In the same time period, failure of satellites and other devices using pure tin solders has been blamed on tin whisker growth. The accepted driving force for whisker growth is compressive stresses in films. This article reports a microstructure-control method of limiting whisker growth through the introduction of pores that permit an alternate means of stress relief.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据