Microstructure and physical properties of arc ion plated TiAlN/Cu thin film

Multilayered TiAIN/Cu coatings were produced by using a cathodic vacuum arc (CVA) deposition system. Filter was incorporated to the system in order to get rid of oversized particles. The TiAIN layer gives a columnar structure. If the TiAIN deposit was interrupted periodically by adding copper to its composite, TiAIN/Cu nanomultilayer structure formed. Which can be clearly observed through high-resolution transmission electron microscopy (HRTEM), and the thickness of periodic nano-laminates of TiAIN in composite TiAIN/Cu coatings is approximately 7-8 nm. EDS analysis showed the copper content in TiAIN/Cu specimen is only about 4.5 at.%, yet it brings significant influence to the film composition, in which the titanium is suppressed while the aluminum is increased. By adding copper to TiAIN, the electron diffraction patterns were changed from spotty ring to continuous indicating the formation of nanocrystalline structure in TiAIN/Cu multilayered coating. The oxidation resistant temperature of TiAIN coating is examined at about 868.8 degrees C, and decreased to about 855.7 degrees C after adding copper in the coating. The nanoindentation measurement of TiAIN/Cu multilayered coated material shows a higher elastic modulus of about 361 GPa than that of TiAIN about 348 GPa, but a lower hardness of about 24 CiPa than that of TiAIN about 30 CiPa. (c) 2006 Elsevier B.V. All rights reserved.