期刊
JOURNAL OF ALLOYS AND COMPOUNDS
卷 429, 期 1-2, 页码 192-197出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2006.04.037
关键词
creep; stress exponent; indentation; impression; relaxation; solder alloy
Creep behavior of Sn-40%Pb-2.5%Sb peritectic solder alloy having two different grain sizes was studied by indentation, impression, stress relaxation and conventional creep tests at room temperature (T > 0.65 T-m) in order to evaluate the correspondence of the creep results. Stress exponent values have been determined through these methods and in all cases the calculated exponents are in good agreement. The stress exponent values in the range 2.55-3.20, depending on the testing method and grain size of the materials, indicate that grain boundary sliding is the possible mechanism during room-temperature creep deformation of this alloy. (c) 2006 Elsevier B.V. All rights reserved.
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