Thermally conductive silicone rubber used as elastomeric thermal pad is successfully developed with boron nitride powder as conductive filler. The effects of content and particle size of filler on the thermal conductivity and mechanical property of silicone rubber are investigated. The results indicate that the use of hybrid boron nitride with three different particle sizes at a preferable weight ratio gives silicone rubber better thermal conductivity compared with each boron nitride with single particle size at the same total filler content. Furthermore, scanning electron microscopy, differential scanning calorimeter, thermogravimetric, etc., are used to characterize the morphology, curing behavior, thermal stability, and coefficient of thermal expansion (CTE) of the silicone rubber composites.
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