期刊
SURFACE & COATINGS TECHNOLOGY
卷 201, 期 9-11, 页码 5574-5577出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.surfcoat.2006.07.227
关键词
Cu; thin film; surface morphology; dynamic scaling; magnetron sputtering
Copper thin films were deposited onto rough Al2O3 and Si (100) substrates using R.F. magnetron sputtering technique at room temperature. Surface morphology of thin films was detected by atomic force microscopy (AFM) and was characterized by dynamic scaling theory. The effect of substrate on the surface evolution of thin films was investigated. Roughness exponent a and growth exponent beta were obtained by height-height correlation function and root-mean-square (RMS) roughness measurement. The results show that surface roughness of Cu thin films on Al2O3 substrates first decrease and then increase with increasing thickness, which can be explained by the contribution of rough substrate surface profile. During the initial deposition, the rough substrate morphology leads to a decrease of the measured growth exponent value, while it has no effect on the measurement of roughness exponent. With regards to the effect of the rough substrate surface profile, a and P of thin films deposited on Al2O3 are 0.83 +/- 0.05 and 0.32 +/- 0.03, respectively, while those of thin films deposited on Si substrates are 0.78 +/- 0.02 and 0.37 +/- 0.04, which indicates that substrate type has an important influence on surface dynamic evolution. (C) 2006 Elsevier B.V. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据