期刊
MEASUREMENT SCIENCE AND TECHNOLOGY
卷 18, 期 3, 页码 852-858出版社
IOP PUBLISHING LTD
DOI: 10.1088/0957-0233/18/3/038
关键词
photovoltaics; crack detection; micro crack; solar cell; defect; wafer; silicon; resonance; acoustics
The resonance ultrasonic vibrations (RUV) technique is adapted for non-destructive crack detection in full-size silicon wafers for solar cells. The RUV methodology relies on deviation of the frequency response curve of a wafer, ultrasonically stimulated via vacuum coupled piezoelectric transducer, with a periphery crack versus regular non-cracked wafers as detected by a periphery mounted acoustic probe. Crack detection is illustrated on a set of cast wafers. We performed vibration mode identification on square-shaped production-grade Si wafers and confirmed by finite element analyses. The modelling was accomplished for the different modes of the resonance vibrations of a wafer with a periphery crack to assess the sensitivity of the RUV method relative to crack length and crack location.
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