期刊
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS
卷 46, 期 4B, 页码 2474-2480出版社
JAPAN SOC APPLIED PHYSICS
DOI: 10.1143/JJAP.46.2474
关键词
silicon; light-emitting devices; Si LED; CMOS integrated circuitry; optoelectronics
In this paper, we report on an increase in emission intensity of up to 10 nW/mu m(2) that has been realized with a new novel two junction, diagonal avalanche control, and minority carrier injection silicon complementary metal-oxide-semiconductor (CMOS) light emitting device (LED). The device utilizes a four-terminal configuration with two embedded shallow n(+) P junctions in a p substrate. One junction is kept in deep-avalanche and light-emitting mode, while the other junction is forward biased and minority carrier electrons are injected into the avalanching junction. The device has been realized using standard 0.35 mu m CMOS design rules and fabrication technology and operates at 9 V in the current range 0.1-3 mA. The optical output power is about one order of magnitude higher for previous single-junction n(+)p light-emitting devices while the emission intensity is about two orders of magnitude higher than for single-junction devices. The optical output is about three orders of magnitude higher than the low-frequency detectivity limit of silicon p-i-n detectors of comparable dimensions. The realized characteristics may enable diverse optoelectronic applications in standard-CMOS-silicon-technology-based integrated circuitry.
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