期刊
JOURNAL OF ALLOYS AND COMPOUNDS
卷 434, 期 -, 页码 375-377出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.jallcom.2006.08.176
关键词
AlN-Cu powder; mechanical alloying; thermal expansion; thermal conductivity
This study investigates coefficients of thermal expansion (CTE) and thermal conductivity (TC) of pulse electric current sintered mechanical alloying (MA) AIN-Cu powder compacts for the heat sink material application. The CTEs of MA AIN-Cu powder compacts showed good consistency with Turner's model when the volume fraction of copper was less than 60%, even in presence of some pores. When it was more than 60%, the values of thermal expansion had good agreement with the rule of mixtures. The porosity compensated TCs of AIN-40, 60, and 80 vol.% Cu measured at 200 degrees C were 62.7, 82.2, and 95.1 W m(-1) K-1. (C) 2006 Elsevier B.V. All rights reserved.
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