期刊
IEEE TRANSACTIONS ON MAGNETICS
卷 43, 期 6, 页码 2713-2715出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TMAG.2007.893707
关键词
magnetic forces; self-assembly
This paper, focuses on quantification and optimization of micromagnetic bonding forces to enable a technique of magnet array self-assembly (MASA). MASA is envisioned to uniquely assemble different microscale components using arrays of hard micromagnets, which are pre-patterned onto the component surfaces via batch-fabrication. Finite-element (FEM) and analytical methods are used to analyze the dependence of magnetic bonding forces on the size, shape, and magnetization of individual pairs of magnets as well as arrays of magnets. The advantages of using micromagnet arrays in place of single magnets for chip scale self-assembly are explored.
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