Composite micromechanical resonators were encapsulated in a hermetic environment using a wafer-scale encapsulation process compatible with complementary metal-oxide semiconductor processing. The resonator structure is comprised of single crystal silicon with a silicon dioxide coating and shows a frequency-temperature sensitivity that is comparable to uncompensated quartz crystal resonators. A frequency variation of less than 200 ppm is achieved over a -40-125 degrees C temperature range. The resonator exhibits a quadratic temperature behavior with a turnover temperature at which the frequency becomes insensitive to small temperature changes. The turnover temperature can be controlled for use in high precision frequency references. (c) 2007 American Institute of Physics.
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