Work hardening of ultrafine-grained copper with nanoscale twins

Work hardening behaviors of electrodeposited ultrafine-grained Cu with nanoscale growth twins are investigated by means of uniaxial continuous tensile and loading-unloading tests. A high density of nanoscale twins leads to a significant enhancement in flow strength and work hardening rate, while the work hardening coefficient (n) does not show any obvious variation with the twin density. These effects were analyzed in terms of the post-deformation microstructures. (C) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.