期刊
THERMOCHIMICA ACTA
卷 459, 期 1-2, 页码 34-39出版社
ELSEVIER
DOI: 10.1016/j.tca.2007.04.004
关键词
calorimetry; enthalpy of formation; lead-free solder alloy; intermetallic compounds
Standard enthalpies of formation were determined for a number of binary intermetallic compounds in the systems Ag-Sn, Cu-Sn, and Ni-Sn by means of solution calorimetry in liquid Sn in a Calvet-type microcalori meter. For the pure elements Ag, Cu, and Ni, the limiting partial enthalpies of mixing as well as the enthalpies of solution at infinite dilution in Sn were measured at 773, 873, 973 and 1073 K. The results for the enthalpy of formation for the intermetallic compounds Ag3Sn, Ag4Sn, Cu3Sn, Cu41Sn11, Cu6Sn5, Ni3Sn-LT, Ni3Sn2-HT, and Ni3Sn4 are discussed and compared with the corresponding literature values. (c) 2007 Elsevier B.V. All rights reserved.
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