On interface strengthening ability in metallic multilayers

The strength of Cu/Au multilayers with different individual layer thicknesses (),) from 25 to 250 nm has been investigated by nanoindentation testing. It is found that the increase in strength of the Cu/Au multilayers with decreasing). follows the Hall-Petch relation until 1 is less than 50 nm. Based on the concept of lattice mismatch, a simple model is proposed to describe interface strengthening ability in metallic multilayers found here and reported in the literature. (C) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.