期刊
ACTA MATERIALIA
卷 55, 期 13, 页码 4429-4438出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2007.04.009
关键词
crystallographic textures; Cu films; pulsed electrodeposition; mechanical and electrical properties; twins
This paper reports the influence of substrates and peak current densities on: crystallographic textures; twin density, thickness, spacing and twin boundary orientations; and electrical transport and mechanical properties of Cu films fabricated by pulsed electrodeposition. Films of {311}, {100}, {110} and {111} out-of-plane textured Cu with a high density of {111} twins were synthesized. With increasing twin density and change of texture by selection of the peak current densities and substrates, the ultimate tensile strength, hardness and elongation monotonically increase. This paper also discusses the mechanisms for manipulation of texture and twin densities via changing both the peak current densities and substrates, and the correlation among the microstructure, electrical resistivity and mechanical properties. (C) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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