期刊
INTERNATIONAL JOURNAL OF HEAT AND FLUID FLOW
卷 28, 期 4, 页码 753-767出版社
ELSEVIER SCIENCE INC
DOI: 10.1016/j.ijheatfluidflow.2006.09.003
关键词
heat transfer; spray cooling; electronic cooling
Spray cooling is a technology of increasing interest for electronic cooling and other high heat flux applications, and is characterized by high heat transfer, uniformity of heat removal, small fluid inventory, low droplet impact velocity, and no temperature overshoot. The mechanisms by which heat is removed during spray cooling are poorly understood, however, due to its dependence on many parameters that are not easily varied independently, and predictive capabilities are quite limited. This paper provides an introduction to spray cooling for electronic cooling applications, reviews some proposed spray cooling heat transfer mechanisms, and summarizes the data regarding the effects of non-condensable gas, surface enhancement, spray inclination, and gravity. Some models of spray cooling are also presented. (c) 2006 Elsevier Inc. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据