期刊
IEEE TRANSACTIONS ON ADVANCED PACKAGING
卷 30, 期 3, 页码 541-550出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TADVP.2007.898636
关键词
interposer technology; system-on-textile; textile interconnects; textile substrates; wearable computing
This paper presents the necessary ingredients for a successful realization of electrical circuits on fabrics. We start with the specification of a hybrid fabric as substrate. The discussion of textile transmission lines as well as textile interconnects reveals a flat frequency response up to about 2 GHz and 600 MHz, respectively. The proposed transmission lines feature line impedances in the range of 250 Omega. A novel interposer concept is the key technology to our approach of implementing circuits on textiles. We introduce different variants of this interposer and give formulas to determine their fabric area consumption. The presented technologies allow realization and wiring of circuits on fabrics with signal frequencies up to several hundred megahertz.
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