Changes in surface stress of gold electrode during underpotential deposition of copper

The changes in surface stress of the evaporated gold electrode (mainly oriented to the (111) plane) during underpotential deposition (UPD) of copper in 0.1 M sulfuric acid medium or 0.1 M perchloric acid medium with and without sulfate or chloride were measured using a bending beam method. The surface stress maximum of gold electrode appeared during Cu-UPD. The co-adsorption of (bi)sulfate or chloride ions with copper atoms induced the compressive surface stress to promote the Cu-UPD. The factors influencing the surface stress or surface elastic strain were discussed in relation to the Cu-UPD structure.