期刊
ADVANCED MATERIALS
卷 26, 期 34, 页码 5942-+出版社
WILEY-V C H VERLAG GMBH
DOI: 10.1002/adma.201401573
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资金
- National Science Foundation (NSF Grant) [DMI-1068013]
- German Science Foundation (DFG Grants) [JA 1023/3-1]
- Carl-Zeiss Foundation
- Directorate For Engineering
- Div Of Electrical, Commun & Cyber Sys [1068013] Funding Source: National Science Foundation
A first automated reel-to-reel fluidic self-assembly process for macroelectronic applications is reported. This system enables high-speed assembly of semiconductor dies (15 000 chips per hour using a 2.5 cm-wide web) over large-area substrates. The optimization of the system (>99% assembly yield) is based on identification, calculation, and optimization of the relevant forces. As an application, the production of a solid-state lighting panel is discussed, involving a novel approach to apply a conductive layer through lamination.
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