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Transfer Printing Techniques for Materials Assembly and Micro/Nanodevice Fabrication

期刊

ADVANCED MATERIALS
卷 24, 期 39, 页码 5284-5318

出版社

WILEY-V C H VERLAG GMBH
DOI: 10.1002/adma.201201386

关键词

transfer print; flexible electronics; deterministic assembly; additive transfer; subtractive transfer

资金

  1. MURI [FA9550-08-1-0394]
  2. Frederick Seitz Materials Research Lab
  3. Center for Microanalysis of Materials in University of Illinois
  4. U.S. Department of Energy [DE-FG02-07ER46453, DE-FG02-07ER46471]
  5. Center for Nanoscale Chemical Electrical Mechanical Manufacturing Systems in University of Illinois
  6. NSF [CMMI-0328162]

向作者/读者索取更多资源

Transfer printing represents a set of techniques for deterministic assembly of micro-and nanomaterials into spatially organized, functional arrangements with two and three-dimensional layouts. Such processes provide versatile routes not only to test structures and vehicles for scientific studies but also to high-performance, heterogeneously integrated functional systems, including those in flexible electronics, three-dimensional and/or curvilinear optoelectronics, and bio-integrated sensing and therapeutic devices. This article summarizes recent advances in a variety of transfer printing techniques, ranging from the mechanics and materials aspects that govern their operation to engineering features of their use in systems with varying levels of complexity. A concluding section presents perspectives on opportunities for basic and applied research, and on emerging use of these methods in high throughput, industrial-scale manufacturing.

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