期刊
ADVANCED MATERIALS
卷 22, 期 36, 页码 4030-4033出版社
WILEY-V C H VERLAG GMBH
DOI: 10.1002/adma.201000515
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资金
- National Institutes of Health (NIH) [EB006179]
High-density stretchable electronics are achieved using multilayer interconnects on an elastomeric substrate. Two major challenges associated with stretchable electronics-increasing integration density and improving electrical bonding-have been addressed by our innovative multilayer via-bonding technology. The resulting multichip-module architecture provides an elastic, high-density solution for numerous potential applications.
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