A closed-form solution for thermal buckling of piezoelectric FGM rectangular plates with temperature-dependent properties

A thermal buckling analysis is presented for functionally graded rectangular plates that are integrated with surface-bonded piezoelectric actuators and are subjected to the combined action of thermal load and constant applied actuator voltage. The temperature-dependent material properties of the functionally graded plate are assumed to vary as a power form of the thickness coordinate. Derivation of the equations is based on the third-order shear deformation plate theory. Results for the critical buckling temperatures are obtained in closed-form solution, which are convenient to be used in engineering design applications. The effects of the applied actuator voltage, plate geometry, and volume fraction exponent of the functionally graded material on the buckling temperature are investigated.