期刊
ACTA MATERIALIA
卷 58, 期 9, 页码 3429-3443出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2010.02.018
关键词
Transient liquid phase (TLP) soldering; Interface; Intermetallic compounds; Kinetics; Differential scanning calorimetry (DSC)
资金
- Engineering and Physical Science Research Council
- Innovative Electronic Manufacturing Research Centre in the UK
- EPSRC [DT/E005195/1, EP/D068525/1] Funding Source: UKRI
- Engineering and Physical Sciences Research Council [EP/D068525/1, DT/E005195/1] Funding Source: researchfish
The kinetics of the interfacial reaction of a thin layer of Sn sandwiched between two pieces of Ag foil has been investigated at temperatures of 260 degrees C, 300 degrees C and 340 degrees C. A time dependence of the form t(1/n) with n = 3 was obtained for the kinetics of both the consumption of the Sn remaining and the thickening growth of the Ag3Sn scallops formed between Sn and Ag. Such a result can be explained well using the model of grain boundary/molten channel-controlled growth of intermetallic compounds. In this case, the diffusion of Ag atoms through the molten channels existing between the previously formed Ag3Sn scallops is the controlling mechanism for the kinetics. We also report here the derived kinetic constants including reaction constants and the associated activation energy for guiding the practical transient liquid phase soldering of the Ag-Sn-Ag system. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据