4.7 Article

A study of low-strain and medium-strain grain boundary engineering

期刊

ACTA MATERIALIA
卷 57, 期 11, 页码 3410-3421

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2009.04.002

关键词

Copper; Electron backscattering diffraction (EBSD); Grain boundary twin

资金

  1. Engineering and Physical Sciences Research Council [EP/D05284X/1] Funding Source: researchfish
  2. EPSRC [EP/D05284X/1] Funding Source: UKRI

向作者/读者索取更多资源

Grain boundary engineering (GBE) processing schedules, involving low-strain (5% deformation) iterative treatments, have been carried out on copper. Misorientation and grain boundary plane statistics have been derived, plus tensile and hardness measurements. The Sigma 3 length fraction and Sigma 9/Sigma 3 number ratio decreased during the first two processing iterations, whereas maximum GBE misorientation statistics were achieved after three processing iterations. Analysis of mechanical properties data revealed an accumulation of strain energy throughout the first three processing iterations, sufficient to provide enough driving force for extensive Sigma 3(n) interactions. The density of Sigma 3 boundaries had a larger effect on the rate of hardening than did the density of grain boundaries. This finding indicates the effectiveness of Sigma 3 interfaces as barriers to plastic flow, which plays an important role in the early stages of GBE processing. Data from samples that had undergone the low-strain iterations were also compared to medium-strain (25% deformation) processing iterations. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

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