期刊
ACTA MATERIALIA
卷 56, 期 17, 页码 4921-4931出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2008.06.008
关键词
Nanocrystalline Cu; Thin film; Ductility; Cavitation
Void formation in nanocrystalline Cu thin films with a grain size of 100 nm during uniaxial tensile relaxation experiments is quantitatively studied. Cu thin films with a two-dimensional fiber structure were deposited on heat-resistant polyimide substrates and subject to various subcritical uniform uniaxial tensile strains at an elevated temperature (similar to 0.3T(m)), to observe void formations in nanocrystalline metals with a reduced amount of dislocation-based deformation. Microstructural observations were carried out at several stages of deformation, and the evolutions of void formation in subcritical strain levels are quantitatively discussed. A void formation model is proposed for approximating the nucleation and growth rate of voids. The resulting model shows a reasonable agreement with the observed number density and area fraction of voids for various strain levels and grain sizes. On the basis of the results, the stress and grain size dependences of the void formation process are further discussed. (c) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据