4.8 Article

Transformational Silicon Electronics

期刊

ACS NANO
卷 8, 期 2, 页码 1468-1474

出版社

AMER CHEMICAL SOC
DOI: 10.1021/nn405475k

关键词

flexible electronics; silicon (100); MOSCAP; MIMCAP; MOSFET; mu LIB

资金

  1. KAUST OCRF Competitive Research Grant [CRG-1-2012-HUS-008]

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In today's traditional electronics such as in computers or in mobile phones, billions of high-performance, ultra-low-power devices are neatly integrated in extremely compact areas on rigid and brittle but low-cost bulk monocrystalline silicon (100) wafers. Ninety percent of global electronics are made up of silicon. Therefore, we have developed a generic low-cost regenerative batch fabrication process to transform such wafers full of devices into thin (5 mu m), mechanically flexible, optically semitransparent silicon fabric with devices, then recycling the remaining wafer to generate multiple silicon fabric with chips and devices, ensuring low-cost and optimal utilization of the whole substrate. We show monocrystalline, amorphous, and polycrystalline silicon and silicon dioxide fabric, all from low-cost bulk silicon (100) wafers with the semiconductor industry's most advanced high-kappa/metal gate stack based high-performance, ultra-low-power capacitors, field effect transistors, energy harvesters, and storage to emphasize the effectiveness and versatility of this process to transform traditional electronics into flexible and semitransparent ones for multipurpose applications.

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