4.8 Article

Biomass-Directed Synthesis of 20 g High-Quality Boron Nitride Nanosheets for Thermoconductive Polymeric Composites

期刊

ACS NANO
卷 8, 期 9, 页码 9081-9088

出版社

AMER CHEMICAL SOC
DOI: 10.1021/nn502486x

关键词

boron nitride; nanosheet; carbothermal reaction; synthesis; composite

资金

  1. International Center for Young Scientists (ICYS)
  2. World Premier International (WPI) Research Center Initiative on Materials Nanoarchitectonics (MANA)
  3. National Institute for Materials Science (NIMS)
  4. KAKENHI from the Japan Society for the Promotion of Science (JSPS) [26820322]
  5. Ministry of Education, Culture, Sports, Science & Technology (MEXT) in Japan
  6. National Project for the Development of Key Scientific Apparatus [2013YQ12034506]
  7. Program for New Century Excellent Talents in University in the People's Republic of China [NCET-12-0573]
  8. Grants-in-Aid for Scientific Research [26820322] Funding Source: KAKEN

向作者/读者索取更多资源

Electrically insulating boron nitride (BN) nanosheets possess thermal conductivity similar to and thermal and chemical stabilities superior to those of electrically conductive graphenes. Currently the production and application of BN nanosheets are rather limited due to the complexity of the BN binary compound growth, as opposed to massive graphene production. Here we have developed the original strategy biomass-directed on-site synthesis toward mass production of high-crystal-quality BN nanosheets. The strikingly effective, reliable, and high-throughput (dozens of grams) synthesis is directed by diverse biomass sources through the carbothermal reduction of gaseous boron oxide species. The produced BN nanosheets are single crystalline, laterally large, and atomically thin. Additionally, they assemble themselves into the same macroscopic shapes peculiar to original biomasses. The nanosheets are further utilized for making thermoconductive and electrically insulating epoxy/BN composites with a 14-fold increase in thermal conductivity, which are envisaged to be particularly valuable for future high-performance electronic packaging materials.

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