期刊
ACS NANO
卷 7, 期 6, 页码 5499-5505出版社
AMER CHEMICAL SOC
DOI: 10.1021/nn4016407
关键词
four point probe; ultra-shallow junction; delta doping
类别
资金
- Australian Research Council in the form of an Australian Post-Doctoral Fellowship
- Australian Government Federation Fellowship
- Defense Advanced Research Project Agency, Space and Naval Warfare Center, San Diego
- Emerging Technology Fund of the State of Texas [N66001-08-C-2040]
- Division Of Materials Research
- Direct For Mathematical & Physical Scien [1040456] Funding Source: National Science Foundation
Low resistivity, near-surface doping in silicon represents a formidable challenge for both the microelectronics industry and future quantum electronic devices. Here we employ an ultra-high vacuum strategy to create highly abrupt doping profiles in silicon, which we characterize in situ using a four point probe scanning tunnelling microscope. Using a small molecule gaseous dopant source (PH3) which densely packs on a reconstructed silicon surface, followed by encapsulation In epitaxial silicon, we form highly conductive dopant sheets with subnanometer control of the depth profiles. This approach allows us to test the limits of ultra-shallow junction formation, with room temperature resistivities of 780 Omega/square at an encapsulation depth of 4.3 nm, increasing to 23 k Omega/square at an encapsulation depth of only 0.5 nm. We show that this depth-dependent resistivity can be accounted for by a combination of dopant segregation and surface scattering.
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