期刊
ACS APPLIED MATERIALS & INTERFACES
卷 6, 期 11, 页码 8639-8645出版社
AMER CHEMICAL SOC
DOI: 10.1021/am501323m
关键词
thermal conductivity; graphene oxide; boron nitride; polyimide; dimensional stability
资金
- Ministry of Economic Affairs, Taiwan [100-EC-17-A-07-S1-120]
- National Science Council of Taiwan [NSC 100-2221-E-167-006]
Coupling agent-functionalized boron nitride (f-BN) and glycidyl methacrylate-grafted graphene (g-TrG) are simultaneously blended with polyimide (PO to fabricate a flexible, electrically insulating and thermally conductive PI composite film. The silk-like g-TrG successfully fills in the gap between PI and f-BN to complete the thermal conduction network. In addition, the strong interaction between surface functional groups on f-BN and g-TrG contributes to the effective phonon transfer in the PI matrix. The thermal conductivity (TC) of the PI/f-BN composite films containing additional 1 wt % of g-TrG is at least doubled to the value of PI/f-BN and as high as 16 times to that of the pure PI. The hybrid film PI/f-BN-50/g-TrG-1 exhibits excellent flexibility, sufficient insulating property, the highest TC of 2.11 W/mK, and ultralow coefficient of thermal expansion of 11 ppm/K, which are perfect conditions for future flexible substrate materials requiring efficient heat dissipation.
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