期刊
ACS APPLIED MATERIALS & INTERFACES
卷 5, 期 18, 页码 8889-8896出版社
AMER CHEMICAL SOC
DOI: 10.1021/am401127s
关键词
ALD; TDMASn; SnSx; tin sulfides; composition; electronic structure
资金
- National Research Foundation of Korea (NRF)
- Korean Government (MEST) [2012-0005474]
- National Research Foundation of Korea [2011-0015436] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
In this study, tin sulfide thin films were obtained by atomic layer deposition (AID) using Tetrakis(dimethylamino)tin (TDMASn, [(CH3)(2)N](4)Sn) and hydrogen sulfide (H2S). The growth rate of the tin sulfides (SnSx) was shown to be highly dependent on the deposition temperature, and reaction times of 1 second for the TDMASn and H2S were required to reach the saturation regime. Surface morphologies were smooth or rectangular with rounded corners as observed by a field emission scanning electron microscope (FE-SEM) and were dependent on temperature. X-ray diffraction results confirmed that the crystal structure of SnSx can be tuned by changing the AID temperature. Below 120 degrees C, SnSx films appeared to be amorphous. In addition, SnSx films were SnS2 hexagonal at 140 and 150 degrees C and SnSx orthorhombic above 160 degrees C. Similarly, the values of the optical band gap and binding energy showed significant differences between 150 and 160 degrees C. The electronic structures of SnSx were extracted by UPS and absorption spectroscopy, and the unsaturated Sn 3d molecular orbital (MO) states in the band edge were found to be responsible for the great improvement in electrical conductivity. This study shows that TDMASn-H2S ALD is an effective deposition method for SnSx films, offering a simple approach to tune the physical properties.
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