期刊
ACS APPLIED MATERIALS & INTERFACES
卷 5, 期 15, 页码 7633-7640出版社
AMER CHEMICAL SOC
DOI: 10.1021/am401939z
关键词
hexagonal boron nitride; polymer composite; magnetic alignment; thermal conductivity; coefficient of thermal expansion
We report magnetic alignment of hexagonal boron nitride (hBN) platelets and the outstanding material properties of its polymer composite. The magnetically responsive hBN is produced by surface modification of iron oxide, and their orientations can be controlled by applying an external magnetic field during polymer curing. Owing to the anisotropic properties of hBN, the epoxy composite with aligned hBN platelets shows interesting properties along the alignment direction, including significantly reduced coefficient of thermal expansion, reaching similar to 28.7 ppm/degrees C, and enhanced thermal conductivity, 104% higher than that of unaligned counterpart, both of which are observed at a low filler loading of 20 wt %. Our modeling suggests the filler alignment is the major reason for these intriguing material properties. Finite element analysis reveals promising applications for the magnetically aligned hBN-based composites in modern microelectronic packaging.
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