期刊
ACS APPLIED MATERIALS & INTERFACES
卷 1, 期 3, 页码 584-589出版社
AMER CHEMICAL SOC
DOI: 10.1021/am8001346
关键词
electroless deposition; self-assembled monolayers; copper vias; dithiols; microcontact printing; palladium nanoparticles
资金
- ANR [ANR-05-BLAN-008-02]
The paper reports the use of self-assembled monolayers (SAMS) of dithiols to induce elcctroless copper deposition on a gold substrate. The metallization catalyst, palladium nanoparticles, is bound on the dithiol SAM. The assembly process is followed by I R and X-ray photoelectron spectroscopies to confirm the formation of a monolayer with bound catalyst. Electroless metallization is then carried out with a steady deposition rate of 130 nm/min. Additionally, microcontact printing of the catalyst on the SAM by poly(dimethylsiloxane) stamps is used to localize copper deposits. Resulting metallization is selective and allows for a high resolution.
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