期刊
ROYAL SOCIETY OPEN SCIENCE
卷 5, 期 7, 页码 -出版社
ROYAL SOC
DOI: 10.1098/rsos.172417
关键词
copper ink; air-atmosphere sintering; paper electronics; flexible devices
资金
- Ministry of Education, Culture, Sports, Science, and Technology (MEXT), Japan [15H03520, 15H03526, S1311041]
- Grants-in-Aid for Scientific Research [15H03526, 15H03520] Funding Source: KAKEN
Cellulose paper is an attractive substrate for paper electronics because of its advantages of flexibility, biodegradability, easy incorporation into composites, low cost and eco-friendliness. However, the micrometre-sized pores of cellulose paper make robust/conductive films difficult to deposit onto its surface from metal-nanoparticle-based inks. We developed a Cu-based composite ink to deposit conductive Cu films onto cellulose paper via low-temperature sintering in air. The Cu-based inks consisted of a metallo-organic decomposition ink and formic-acid-treated Cu flakes. The composite ink was heated in air at 100 degrees C for only 15s to give a conductive Cu film (7 x 10(-5) Omega cm) on the cellulose paper. Filtration of the Cu-based composite ink accumulated Cu flakes on the paper, whiCh enabled formation of a sintered Cu film with few defects. A strategy was developed to enhance the bending stability of the sintered Cu films on paper substrates using polyvinylpyrrolidone-modified Cu flakes and amine-modified paper. The resistance of the Cu films increased only 1.3-fold and 1.1-fold after 1000 bending cycles at bending radii of 5 mm and 15 mm, respectively. The results of this study provide an approach to increasing the bending stability of Cu films on cellulose paper.
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