4.8 Article

High-Throughput Fabrication of Flexible and Transparent All-Carbon Nanotube Electronics

期刊

ADVANCED SCIENCE
卷 5, 期 5, 页码 -

出版社

WILEY
DOI: 10.1002/advs.201700965

关键词

carbon nanotubes; flexible electronics; photosensitive dry films; thin-film transistors; transparent electronics

资金

  1. Ministry of Science and Technology of China [2016YFA0200101, 2016YFB04001104, 2016YFA0200102]
  2. National Natural Science Foundation of China (NSFC) [51532008, 51521091, 51625203, 51572264, 51272256, 51372254, 61422406, 61574143, 51502304]
  3. China Postdoctoral Science Foundation [2015M58137]
  4. Chinese Academy of Sciences [KGZD-EW-T06, QYZDB-SSWSLH031]
  5. CAS/SAFEA International Partnership Program for Creative Research Teams
  6. Thousand Talent Program for Young Outstanding Scientists
  7. NSFC [61775032, 21373262]
  8. Fundamental Research Funds for the Central Universities [N160404009]

向作者/读者索取更多资源

This study reports a simple and effective technique for the high-throughput fabrication of flexible all-carbon nanotube (CNT) electronics using a photosensitive dry film instead of traditional liquid photoresists. A 10 in. sized photosensitive dry film is laminated onto a flexible substrate by a roll-to-roll technology, and a 5 mu m pattern resolution of the resulting CNT films is achieved for the construction of flexible and transparent all-CNT thinfilm transistors (TFTs) and integrated circuits. The fabricated TFTs exhibit a desirable electrical performance including an on-off current ratio of more than 10(5), a carrier mobility of 33 cm(2) V-1 s(-1), and a small hysteresis. The standard deviations of on-current and mobility are, respectively, 5% and 2% of the average value, demonstrating the excellent reproducibility and uniformity of the devices, which allows constructing a large noise margin inverter circuit with a voltage gain of 30. This study indicates that a photosensitive dry film is very promising for the low-cost, fast, reliable, and scalable fabrication of flexible and transparent CNT-based integrated circuits, and opens up opportunities for future high-throughput CNT-based printed electronics.

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